Mobile phone Block Diagram part 2


Part Data (Operating System)

This section serves as an Operating System that manages data and is giving orders to all parts contained in Ponsel.komponen who work there are some parts, such as:

1. IC CPU

2. IC RAM

3. IC FLASH

4. Keypad

5. LCD

The tasks from the CPU itself as well as components that help:

1. IC CPU is a data processing center on Cellular Telephone

2. IC CPU work supported by the IC RAM as a storage operating system / programs running on the phone.

3. Flash IC that stores data that is temporary, which can be changed as desired mobile phone users

3. Keypad function here ordered the CPU to process data as desired mobile phone users

4. LCD received instructions from the CPU to display all processes currently running on the phone.

System of the Operating System Components:

1. Data is entered into the phone through a program that already exists on the computer intermediary Flash cable (for Flasher) and Data Cable (For apikasi)

2. Computer Data from the PPM and MCU into the IC Flash IC Flash and PPM data store consisting of Menu, Application, language, type of data is temporary and can be changed directly by users

3. While the MCU data is sent to the EEPROM (Elctrically Erase Programmable Read Only Memory), which consists of the Mobile Identity IMEI, Sec.Code and Phone Code.

4. CPU RAM IC is assisted by the PPM data processing function is the IC Flash to be forwarded to the IC Hardware and displayed on the screen (LCD) and check the data in EEPROM as Cellular Telephone identity to be recognized by the CPU.

In the latest phones now there are some that are combined into satu.Yaitu IC IC UEM / UAM

UEM IC consists of several components that have been integrated, including:

IC Power Supply

IC Audio

Charging IC

UPP IC

IC UAM (Often referred to by the term IC IC Qualcom ~ because most branded Qualcom ~ UAM)

Consisting of several components that have been integrated, including:

1. IC CPU

2. IC EEPROM

3. IC FLASH

Audio Section
The part that worked on this component are:

IC Audio

Buzer

Speaker

Microphone

1. Audio amplifier IC as vibration sound signal, and a change of vibration sound signal into sound vibrations.

2. Microphone alter the sound vibrations into vibration sound signal will diperkat by IC Audio.

Working System Components section Audio:

1. Audio IC receives the voice signal from the RF IC to be strengthened and forwarded to Loudspeaker

2. On the loudspeaker voice signal is converted into sound vibrations that can be heard.

3. Microphone alter the sound vibrations into sound signals and transmitted to the IC Audio

4. In the IC Audio sound signal amplified and transmitted to the RF IC to the radiated through the TX.

5. The function of the CPU as a controller of the IC work and manage the performance of IC Audio Audio shaped data.

6. Incoming voltage to IC Audio namely VBB as standby voltage, input voltage when VCOBBA as to the workings of all parts of the IC Audio and voltage VREF as a detector / controller voltage coming into the IC Audio.